Hardware Engineering Capabilities
We design custom multi-layer electronic boards and write bare-metal firmware tailored around industry-grade STM32 microcontrollers and cloud-native ESP32 chips.
Interactive Multi-Layer PCB Stackup
Modern high-speed circuits demand precision electromagnetic routing and thermal layouts. Click the buttons below to highlight and inspect the structural layers in our typical 4-layer industrial designs.
STM32 vs ESP32 Architectures
Depending on your operational environment, we configure custom boards with either deterministic real-time STM chips or cloud-native ESP engines.
STM32 (ARM Cortex) Platforms
Deterministic ControlBest suited for heavy machinery automation, solar telemetry sub-meters, and high-frequency analog sensor analysis.
- Dual-core ARM Cortex-M4/M7 running up to 480 MHz
- Hardware-in-the-loop DSP instructions for vibration FFT
- Galvanic isolated communication interfaces (CAN, RS485)
ESP32 (Tensilica Xtensa) Platforms
Cloud-Native ConnectivityBest suited for battery-powered remote fields (agriculture soil suites), smart relays, and wireless mesh networks.
- Tensilica 32-bit LX6/LX7 dual-core chips
- Integrated Wi-Fi & Bluetooth LE antennas
- Deep sleep modes drawing less than 5µA current