ROKOMARI IT
Hardware Engineering & Firmware

AI-Assisted Multi-Layer PCB Layout Design

Routing 12-layer boards faster and cleaner with reinforcement learning.

Diagnostic Profile

Operational Efficiency Metrics

Resource Savings 40% cost reduction vs imported boards
Payback Period 10 months investment payback
Integration Value Custom form factor fitting legacy cabinets
Target Metric ATEX explosion-proof certified design
Architecture & Philosophy

System Implementation Overview

Using AI-driven routing tools to design dense, noise-isolated, and thermal-efficient PCBs.

Technical Specification Scope

Uses reinforcement learning to map track traces, minimize via counts, and optimize thermal footprints across 4–12 layer stackups.

System Telemetry Pipeline

[Schematic Netlist] → [AI Placement Engine] → [RL Trace Router] → [EM Field Solver] → [Gerber Output]

Solution Specifications

Layer Capability 4 to 12 layers stackup design
Processor Core ARM Cortex-M4/M7, ESP32 Xtensa dual-core
PCB Material FR4 High-TG dielectric core (1.6mm)
Impedance Target 50 Ω single-ended / 90 Ω differential
Firmware OS Bare-metal C/C++, FreeRTOS scheduler
Key Deliverables

Core Operational Capabilities

01

Standard Profile Attribute

RL-based trace escape routing for BGA breakouts

02

Standard Profile Attribute

Characteristic impedance Z₀ validation (50 Ω / 90 Ω)

03

Standard Profile Attribute

Differential pair length matching for high-speed buses

04

Standard Profile Attribute

Thermal via island and copper pour optimization

05

Standard Profile Attribute

Gerber / ODB++ production-ready output

Telemetry Pipeline Flow

End-to-End Operational Architecture

Watch telemetry packets flow in real-time from active field layers up to our dashboard visualization nodes.

FIELD SENSORS GATEWAY NODE-X AURA CLOUD CORE
Simulation Status: Active Telemetry Transmission Loop
Financial Analysis

Interactive ROI Simulator

Adjust operational parameters below to model potential utility, uptime, and maintenance savings matching this deployment scale.

Key Modeling Variables

Values calculated represent average case telemetry audits verified across textile and heavy machinery floors.
PRE-PRODUCTION PROTOTYPE FAILURE RATE 10%
TARGET FLEET PRODUCTION VOLUME 500 Units
Projected Annual Savings -- BDT
Estimated Break-even -- Months
Estimated Efficiency Boost -- %
Target Segments

Tailored Sector Implementations

We design, program, and build telemetry ecosystems specifically tailored for diverse sectors, ensuring strict functionality, security, and scalability.

Public Sector

Streamline public utility grids, automate administrative tasks, and ensure compliance with regional policies. We digitize systems to support public administration workflows and citizen services.

Private Enterprises

Custom multi-tenant architectures integrating HR, finance, inventory, supply chain, and telemetry streams into a central console. Optimized for visibility across physical locations.

SMEs

Lightweight, affordable, and flexible IoT platforms built to reduce manual processes, automate logging, and adapt to future business scaling without massive upfront infrastructure.

Solo Operators

Intuitive, single-operator consoles to monitor machine performance, handle accounting outputs, and analyze field sensors without requiring complex configuration parameters.

Interactive Sandbox

R&D Simulation Console

Interact with our live telemetry compiler or diagnostic simulator mapping specific functions. Select parameters below and run execution sweeps.

Applied Equation Profile

Z₀ = (87 / √(εᵣ + 1.41)) × ln(5.98h / (0.8w + t)) Microstrip Characteristic Impedance
Board Simulator

PCB Trace Stackup & Thermal Load Simulator

Simulate power load heat dissipation in multi-layer FR4 boards to audit trace limits.

Layer 1 (Top Copper Trace) Temperature 25.0 °C
Layer 2 (Ground Plane Shielding) Temperature 25.0 °C
Copper Expansion Profile Nominal (< 0.01%)
Project Lifecycle

Phased Integration Timeline

We deploy custom installations in discrete, controlled phases to prevent interference with your factory floor activities.

Phase 1: Physical Discovery & Audit

Our engineers run a site check of existing machinery, wiring, and electrical panels.

Phase 2: Architecture & Schematic Drafting

We compile register maps, network scopes, and component blueprints.

Phase 3: Hardware Integration & Firmware Flash

Custom PCB nodes are placed, and bare-metal FreeRTOS firmware is loaded.

Phase 4: Telemetry Aggregation & Ingestion

Edge gateways boot, connecting field devices to secure MQTT brokers.

Phase 5: Cloud Dashboards & Client Handoff

We customize the Aura Dashboard, train operators, and transition to SLA support.

Client Handoffs

Field-Proven Success Stories

"The customized telemetry integration transformed our operational processes, making reporting, finance management, and project tracking more efficient than ever. Their engineering team was highly professional."

CB

CARITAS Bangladesh

Managing Director

"The custom telemetry board layout and firmware updates streamlined our physical manufacturing, inventory, and sales streams. The team's attention to detail ensured a seamless implementation that boosted productivity."

IF

Impress Fashion Ltd

Chief Executive Officer

"Our organization needed a reliable database and sensor network to coordinate telemetry across multiple locations. They delivered a highly secure, user-friendly portal. Support has been exceptional."

BS

Bangladesh Scouts

Program Director
Knowledge Base

Frequently Asked Questions

No. We use non-invasive hardware taps, ultrasonic clamp meters, and split-core current transformers that install outside cable jacketing or on auxiliary HMI ports. Your factory floors run uninterrupted.
Every edge device executes signed bootloader checks and connects using mutual TLS (mTLS) certificates. Telemetry payloads are encrypted with AES-256 before leaving the edge node.
Our gateways contain local storage caches (up to 8 GB eMMC ring buffer). If a connection drops, data buffers locally and automatically backfills to the cloud once network links resume, preventing telemetry loss.
Operational Backbone

We don't just build systems. We build digital foundations for smarter operations.

Connect with our engineering office to discuss custom board stackups, edge AI quantization compilation, or private long-range LoRa networks.